Recently, MediaTek unveiled their updated flagship chipset. With a few significant improvements over the 9000, the Dimensity 9000+ is now available. Improvements to the image signal processing and 5G modem are included in addition to a 5 percent CPU boost and a 10 percent graphics boost.
Building on the success of our first flagship 5G chipset, the DImenisty 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out.” – Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit
The Cortex-X2 high-performance processor of the Dimensity 9000+ is cranked up from 3.05GHz to 3.2GHz. Three Cortex-A710 cores and four very efficient Cortex-A510 cores are still equipped in the same 1+3+4 configuration. The Mali-G710 MC10 is the upgraded GPU.
Three cameras can be simultaneously recorded in 18-bit HDR using MediaTek’s Imagiq 790. Additionally, it can handle still photographs up to 320MP at a speed of 9 Gigapixels per second. Additionally, 4K HDR footage with AI noise reduction is supported.
Using 3CC carrier aggregation, the downlink rates of the 5G modem are increased to 7Gbps. In addition, MediaTek’s MiraVision 790 supports WDHD+ displays with frame rates of 144Hz or 180Hz at FHD and Wi-Fi display support up to 4K60 for HDR content. Wi-Fi 6E, Bluetooth 5.3, and these features are also supported.
The Dimensity 9000+ might debut in smartphones as early as this year’s third quarter, according to MediaTek.